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For example, the InCopy Productivity Kit for InDesign. The present invention relates to fabrication methods and resulting structures for semiconductor devices. More particularly, the present invention provides a method and structure for fabrication of a semiconductor device such as a capacitor for dynamic random access memory. As semiconductor integration continues to increase, the need for smaller, higher density memory devices also increases. In an attempt to provide increased storage capability, dynamic random access memory (DRAM) chips have been designed with capacitors having higher capacitance per area. However, as integrated circuits have been further miniaturized, the size of the capacitors have also had to be decreased to fit within the small memory cell area. However, decreasing the size of the capacitors results in a reduction of available capacitance per unit area, and thus, a reduction in capacitance. Accordingly, the ability to fabricate capacitors within a limited area of a memory cell continues to be a primary design consideration. In addition to the need to decrease the size of capacitors, there is also a need to reduce the current required to store a charge on the capacitor. Reducing the current necessary to store charge requires a reduction in the thickness of the capacitor dielectric film. However, the use of thinner dielectric films results in capacitors having increased leakage current. The leakage current is a direct result of the tunneling of charge through the thin dielectric film. Because of the resulting leakage current, the use of thin dielectric films is generally limited to around 25 xc3x85. Accordingly, it would be desirable to provide a method of forming capacitors that can fit within the reduced dimensions required for high density memory devices, such as DRAM devices. One aspect of the present invention provides a method of fabricating a capacitor that includes forming a bottom capacitor electrode, forming a dielectric film over the bottom electrode, forming an upper capacitor electrode over the dielectric film, and forming a liner over the bottom electrode and dielectric film. The method is particularly useful for fabrication of DRAMs and other semiconductor devices. The method includes forming a bottom electrode over a substrate and forming a dielectric film over the bottom electrode. A capacitor structure is then formed over the dielectric film. The capacitor structure includes a bottom electrode, a dielectric film, and an upper electrode. The method further includes forming a liner over the bottom electrode and the dielectric film prior to forming the upper electrode. Because the liner is formed over the bottom electrode, the dielectric film, and the substrate, the liner can then serve to prevent the lower portions of the dielectric film from being etched during formation of the upper electrode. In one embodiment, the bottom electrode is formed by a semiconductor material such as polysilicon. The dielectric film 1a423ce670 Adobe InCopy Crack+ Free License Key Create, edit and manage text documents and business graphics into a digital design process. Professional Features: Advanced text-editing features right into a graphics design suite. Simultaneous gallery access, as well as a layout preview. Simplified workflow by taking control of the document content and redesigning it into any layout type. Support for InDesign integration for greater workflow efficiency. Reinventing the file sharing experience We’ve made it easy to connect to Dropbox. And we’ve made it easy to control access to files with new sharing options. 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